TY - GEN
T1 - Design and Implementation of a prototype based on IoT for corn crops
AU - Huaman, Geraldin Montanez
AU - Julcapoma, Milton Rios
AU - Curasma, Ronald Paucar
AU - Mendoza, Pedro Jose Garcia
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - In this article, we implemented a prototype based on IoT using LoRa technology to monitor edaphic and climatic variables of starchy corn crops, the architecture of the prototype consists of three layers whose functions are as follows. The first layer is responsible for transmitting the information collected by sensors to a gateway through the LoRa network. The second layer is responsible for retransmitting the information to the Internet through LTE mobile networks. The third layer is responsible to display the data collected by the sensors to end-users to help them make better decisions. Finally, performance tests of the prototype were carried out in a laboratory and preliminary tests were carried out on corn crops in Pampas-Huancavelica.
AB - In this article, we implemented a prototype based on IoT using LoRa technology to monitor edaphic and climatic variables of starchy corn crops, the architecture of the prototype consists of three layers whose functions are as follows. The first layer is responsible for transmitting the information collected by sensors to a gateway through the LoRa network. The second layer is responsible for retransmitting the information to the Internet through LTE mobile networks. The third layer is responsible to display the data collected by the sensors to end-users to help them make better decisions. Finally, performance tests of the prototype were carried out in a laboratory and preliminary tests were carried out on corn crops in Pampas-Huancavelica.
KW - corn crops
KW - Internet of Things
KW - LoRa
KW - Node-Red
UR - http://www.scopus.com/inward/record.url?scp=85138799587&partnerID=8YFLogxK
U2 - 10.1109/INTERCON55795.2022.9870090
DO - 10.1109/INTERCON55795.2022.9870090
M3 - Contribución a la conferencia
AN - SCOPUS:85138799587
T3 - Proceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
BT - Proceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
Y2 - 11 August 2022 through 13 August 2022
ER -